Stationary and non-stationary etching of Si(100) surfaces with gas phase and adsorbed hydrogen

Citation
A. Dinger et al., Stationary and non-stationary etching of Si(100) surfaces with gas phase and adsorbed hydrogen, CHEM P LETT, 320(5-6), 2000, pp. 405-410
Citations number
17
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
CHEMICAL PHYSICS LETTERS
ISSN journal
00092614 → ACNP
Volume
320
Issue
5-6
Year of publication
2000
Pages
405 - 410
Database
ISI
SICI code
0009-2614(20000414)320:5-6<405:SANEOS>2.0.ZU;2-A
Abstract
Stationary and non-stationary etching of Si(100) surfaces by hydrogen were studied between 200 K and 800 K using direct product detection and thermal desorption spectroscopy. Silane was the only etch product observed. The rat es of silane SiDnH4-n isotopes measured during etching D-saturated Si(100) surfaces with gaseous H illustrate that the etch reaction proceeds between surface silyl and incoming H in a direct (Eley-Rideal or hot-atom) reaction step: H(g) + SiD3(ad) --> SiD3H(g). Non-stationary etching via silane deso rption occurs through disproportionation between surface dihydride and sily l groups, SiH2(ad) + SiH3(ad) --> SiH4(g). (C) 2000 Elsevier Science B.V. A ll rights reserved.