Comparison of thermal sweeper and cryogenic modulator technology for comprehensive gas chromatography

Citation
Pj. Marriott et al., Comparison of thermal sweeper and cryogenic modulator technology for comprehensive gas chromatography, HRC-J HIGH, 23(3), 2000, pp. 253-258
Citations number
8
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences
Journal title
HRC-JOURNAL OF HIGH RESOLUTION CHROMATOGRAPHY
ISSN journal
09356304 → ACNP
Volume
23
Issue
3
Year of publication
2000
Pages
253 - 258
Database
ISI
SICI code
0935-6304(200003)23:3<253:COTSAC>2.0.ZU;2-5
Abstract
The two current technologies for achieving comprehensive gas chromatography (GC x GC) - the thermal sweeper and the cryogenic modulator - are compared in an interlaboratory study using a multicomponent semi-volatile aromatic compound sample, The same column set (phases, film thickness, dimensions of columns) and conditions of oven temperature program were used, Carrier gas flow settings however were different for the data reported here. The therm al sweeper has a longer overall length due to the extra ca. 30 cm length of narrow bore tubing used for the modulator/accumulator section. Data reveal that the two methods behave in an analogous manner in respect of deliverin g GC x GC results, with key peak parameters of peak widths and symmetry mea sures showing good correlation Retention time dissimilarity on the first di mension columns in the two systems arises from different flow rates used, h owever the second column retention is similar, and this is due to the resul ting different elution temperatures that peaks elute on the first dimension in each system. Overall, the two approaches to GC x GC appear to produce e quivalent results within the scope of the application studied. Each system does have its experimental limitations; the thermal sweeper has what may be called a 'thick film effect', where at high temperature it can be difficul t to sufficiently trap the migrating bands in the accumulator column, and t he pulsing of solutes in the cryogenic system may suffer from a 'thick wall effect' if a column with too thick a wall dimension is used at low oven te mperature.