Fabrication of buried corrugated waveguides by wafer direct bonding

Citation
S. Pelissier et al., Fabrication of buried corrugated waveguides by wafer direct bonding, J LIGHTW T, 18(4), 2000, pp. 540-545
Citations number
18
Categorie Soggetti
Optics & Acoustics
Journal title
JOURNAL OF LIGHTWAVE TECHNOLOGY
ISSN journal
07338724 → ACNP
Volume
18
Issue
4
Year of publication
2000
Pages
540 - 545
Database
ISI
SICI code
0733-8724(200004)18:4<540:FOBCWB>2.0.ZU;2-5
Abstract
A new fabrication method of deeply buried corrugated waveguides is presente d. It uses a direct bonding process and allows us to make efficient grating couplers in waveguides. The efficiency of the grating is enhanced by enclo sing air in its grooves during the fabrication process, A demonstrator base d on a waveguide produced by ion exchange has been fabricated and tested. T heoretical and experimental results are compared.