Apparent depths of B and Ge deltas in Si as measured by secondary ion massspectrometry

Citation
Zx. Jiang et al., Apparent depths of B and Ge deltas in Si as measured by secondary ion massspectrometry, J VAC SCI B, 18(2), 2000, pp. 706-712
Citations number
33
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
18
Issue
2
Year of publication
2000
Pages
706 - 712
Database
ISI
SICI code
1071-1023(200003/04)18:2<706:ADOBAG>2.0.ZU;2-5
Abstract
The apparent depths of B and Ge deltas in Si were measured with secondary i on mass spectrometry using 1-4 keV O-2(+) beams at oblique incidence (40 de grees-80 degrees with respect to the surface normal). The real depths of th e Ge deltas were obtained via calibration against transmission electron mic roscopy (TEM). The measured centroids of the Ge delta peaks were 0.5+/-0.4 nm shallower than the red (TEM) depths, independent of angle and energy. Fo r B there was a clear angular dependency of the centroid position, but the energy dependency was virtually absent (viz., differential shift <0.2 nm/ke V/ion). Repeated analyses during a 2.5 year period showed a reproducibility in Ge delta peak position of 0.04 nm. Surprisingly, the slow but continuou s growth of the native surface oxide had no effect on the apparent Ge delta depths. The profile shift of B towards the surface was attributed to the h igh sputter rate during the surface transient and to B outdiffusion under o xygen bombardment. It was concluded that decreasing the beam energy did not reduce the B shift; the positive effect of a thinner surface transient lay er was nullified by a larger (equilibrium) oxygen concentration. In contras t, indiffusion of Ge compensated at all energies and angles the (apparent) Ge shift due to the transient high sputter rate. (C) 2000 American Vacuum S ociety. [S0734-211X(00)08702-3].