Transient liquid-phase bonding in two-phase ternary systems

Citation
Cw. Sinclair et al., Transient liquid-phase bonding in two-phase ternary systems, MET MAT T A, 31(4), 2000, pp. 1187-1192
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science",Metallurgy
Journal title
METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
ISSN journal
10735623 → ACNP
Volume
31
Issue
4
Year of publication
2000
Pages
1187 - 1192
Database
ISI
SICI code
1073-5623(200004)31:4<1187:TLBITT>2.0.ZU;2-#
Abstract
The process of isothermal solidification during transient liquid-phase (TLP ) bonding in a ternary system is analyzed. In the most usual situation, and in contrast to the binary case, the composition of the liquid is required to change continuously as solidification proceeds. If the solubilities and/ or diffusion coefficients of the two solutes are very different, the solidi fication stage is clearly divided into two parabolic regimes, the first dom inated by the "faster" solute and the second by the slower of the two. In e xtreme cases, full solidification may not be realized in experimentally acc essible times.