X-rays are used to determine the stress as a function of depth for five eva
porated gold films of 0.8-2.5 mu m thickness. The depth dependence is achie
ved by varying the incident angle of the X-rays, which affects the penetrat
ion depth of the X-rays into the film. The films, which have a different th
ermal expansion coefficient than the silicon substrate, are strained as a r
esult of thermal cycling after deposition. We find essentially no stress va
riation as a function of depth for these films. (C) 2000 Elsevier Science B
.V. All rights reserved.