Assessment of the adhesion quality of fusion-welded silicon wafers with nonlinear ultrasound

Citation
A. Wegner et al., Assessment of the adhesion quality of fusion-welded silicon wafers with nonlinear ultrasound, ULTRASONICS, 38(1-8), 2000, pp. 316-321
Citations number
23
Categorie Soggetti
Optics & Acoustics
Journal title
ULTRASONICS
ISSN journal
0041624X → ACNP
Volume
38
Issue
1-8
Year of publication
2000
Pages
316 - 321
Database
ISI
SICI code
0041-624X(200003)38:1-8<316:AOTAQO>2.0.ZU;2-4
Abstract
Diffusion bonded silicon wafers are employed in the semiconductor industry. Their bonding quality must be monitored by a nondestructive testing techni que. We present an ultrasonic technique allowing us to monitor the quality of the diffusion bond by measuring the anharmonic content of a transmitted ultrasonic wave. The anharmonicity is caused by weak bonds and manifests it self at high dynamic strains exerted by the ultrasonic wave. The source of nonlinearity is located in the rim of delaminations in the interface. (C) 2 000 Published by Elsevier Science B.V. All rights reserved.