Y. Yamada et al., Evaluation of thermal expansion coefficient of twinned YBa2Cu3O7-delta film for prediction of crack formation on various substrates, JPN J A P 1, 39(3A), 2000, pp. 1111-1115
The effective thermal expansion coefficient of the c-axis-oriented, twinned
YBa2Cu3O7-delta (YBCO) film formed on SrTiO3 (STO) substrates by liquid ph
ase epitaxy was evaluated by observing crack formation of the films. The cr
itical thickness of the YBCO film grown on STO at 920 degrees C is about 1.
35 mu m. A simple fracture model with mechanical properties of materials yi
elds the effective thermal expansion coefficient of YBCO film of about 14.0
x 10(-6)/K, as an engineering value for prediction of crack formation on v
arious substrates. Temperature dependence in the thermal expansion of the s
ubstrate and the film suggests that control of oxygenation conditions enabl
es us to suppress maximum stress induced in the films. According to the est
imation, we predict the critical film thickness on various substrates used
widely in oxide superconductor research.