Effects of deposition pressure on the properties of a low-dielectric constant cyclohexane-based plasma polymer

The effects of deposition pressure on the properties of cyclohexane-based p lasma polymer (CHexPP) thin films were investigated. Deposition of CHexPP t hin films at higher deposition pressures was associated with lower depositi on rates and produced thin films with lower k-values, lower thermal stabili ties and higher etching rates. It is considered that the higher deposition pressure decreases the energies of the charged reactive species generated b y the plasma from the precursor molecules, resulting in less dense and less well doss-linked plasma polymer thin films.