Ballistic electron emission microscopy (BEEM) is used to measure hot-electr
on transport across magnetic metal multilayers. Room temperature measuremen
ts in air have been carried out on Au/M/Si(100), Au/M/Au/Si(100), and Au/M/
PtSi/Si diodes, that were sputter deposited at 175 or 300 K, where M is Co,
Fe, Ni, Cu, or Ni81Fe19. Plots of log BEEM current versus M thickness are
linear giving hot-electron (1.5 eV) attenuation lengths (ALs), for Au/M/Si
diodes (M=Co, Fe, Ni81Fe19, and Ni) of 0.3, 0.5, 0.8, and 1.3 nm, respectiv
ely (with typical standard uncertainties of +/- 10%). Magnetic metal sandwi
ch diodes, (Au/M/Au/Si) show larger ALs, 0.8 and 2.1 nm, for M=Co and Ni81F
e19, respectively. PtSi interlayers improve the surface roughness but have
little effect on the AL while low temperature depositions increase the AL.
We presume that the increases in the AL are due to better microstructure, l
ess silicide reaction, or to changes in elastic scattering at interfaces. (
C) 2000 American Institute of Physics. [S0021-8979(00)71608-2].