Electrodeposition of soft, high moment Co-Fe-Ni thin films

Citation
Xm. Liu et al., Electrodeposition of soft, high moment Co-Fe-Ni thin films, J APPL PHYS, 87(9), 2000, pp. 5410-5412
Citations number
12
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
87
Issue
9
Year of publication
2000
Part
2
Pages
5410 - 5412
Database
ISI
SICI code
0021-8979(20000501)87:9<5410:EOSHMC>2.0.ZU;2-7
Abstract
The electrodeposition of Co-Fe-Ni films from electrolytes without additives and their magnetic and structural properties in the as-deposited and vacuu m annealed states are reported. Co52Fe26Ni22 alloy films exhibit a saturati on magnetization B-s of 20 kG, coercivity H-c around 1 Oe, resistivity of 2 2 mu Omega cm and saturation magnetostriction of about 10(-6). Crystalline structure from bcc to fcc changes with increasing Ni content; films with be st soft magnetic properties are obtained when bcc and fcc structures coexis t. Varying electrolyte formulation or using pulse plating, the deposition p arameters which yield optimum soft magnetic properties vary, but alloy comp osition and crystalline structure of optimum films are unchanged. dc plated films exhibit Ni enrichment at the interface in a region of about 1 mu m t hickness. Easy axis annealing in a vacuum of 10(-7) Torr at 200-280 degrees C for 30 min decreases H-c and slightly decreases the anisotropy field. An nealing, however, does not change B-s, crystalline structure or lattice par ameters, demonstrating stability of the film structure when subjected to ty pical device processing temperature cycles. (C) 2000 American Institute of Physics. [S0021-8979(00)72908-2].