Temperature effects in the hot wire chemical vapor deposition of amorphoushydrogenated silicon carbon alloy

Authors
Citation
Ms. Lee et Sf. Bent, Temperature effects in the hot wire chemical vapor deposition of amorphoushydrogenated silicon carbon alloy, J APPL PHYS, 87(9), 2000, pp. 4600-4610
Citations number
58
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
87
Issue
9
Year of publication
2000
Part
1
Pages
4600 - 4610
Database
ISI
SICI code
0021-8979(20000501)87:9<4600:TEITHW>2.0.ZU;2-J
Abstract
The microstructure, composition, and bonding in hydrogenated amorphous sili con carbon alloy (a-SiC:H) films grown at different substrate temperatures were investigated by a combination of multiple internal reflection-Fourier transform infrared spectroscopy and near edge x-ray absorption fine structu re measurements. Hot wire chemical vapor deposition (HW-CVD) was used to gr ow the thin films at substrate temperatures ranging from 200 to 600 K using mono- and trimethylsilane as precursors. It is found that raising the subs trate temperature during HW-CVD leads to films depleted in the higher hydri des (namely SiH3, SiH2, and CH3) in favor of the lower hydrides (SiH and CH ). This change marks a transition of the film structure from a highly methy lated-polysilane backbone to a polycarbosilane backbone. In addition, some crystalline characteristics appear with increasing substrate temperature, d emonstrating that the change of substrate temperature affects both the hydr ogen configuration and the microstructure of the film. Temperature-dependen t growth of thin a-SiC:H films by HW-CVD is compared with the method of ele ctron cyclotron resonance plasma-enhanced (PECVD). (C) 2000 American Instit ute of Physics. [S0021-8979(00)01609-1].