Ms. Lee et Sf. Bent, Temperature effects in the hot wire chemical vapor deposition of amorphoushydrogenated silicon carbon alloy, J APPL PHYS, 87(9), 2000, pp. 4600-4610
The microstructure, composition, and bonding in hydrogenated amorphous sili
con carbon alloy (a-SiC:H) films grown at different substrate temperatures
were investigated by a combination of multiple internal reflection-Fourier
transform infrared spectroscopy and near edge x-ray absorption fine structu
re measurements. Hot wire chemical vapor deposition (HW-CVD) was used to gr
ow the thin films at substrate temperatures ranging from 200 to 600 K using
mono- and trimethylsilane as precursors. It is found that raising the subs
trate temperature during HW-CVD leads to films depleted in the higher hydri
des (namely SiH3, SiH2, and CH3) in favor of the lower hydrides (SiH and CH
). This change marks a transition of the film structure from a highly methy
lated-polysilane backbone to a polycarbosilane backbone. In addition, some
crystalline characteristics appear with increasing substrate temperature, d
emonstrating that the change of substrate temperature affects both the hydr
ogen configuration and the microstructure of the film. Temperature-dependen
t growth of thin a-SiC:H films by HW-CVD is compared with the method of ele
ctron cyclotron resonance plasma-enhanced (PECVD). (C) 2000 American Instit
ute of Physics. [S0021-8979(00)01609-1].