Thermal strain analysis of composite materials by electronic speckle pattern interferometry

Citation
Ks. Kim et al., Thermal strain analysis of composite materials by electronic speckle pattern interferometry, KSME INT J, 14(5), 2000, pp. 477-482
Citations number
12
Categorie Soggetti
Mechanical Engineering
Journal title
KSME INTERNATIONAL JOURNAL
ISSN journal
12264865 → ACNP
Volume
14
Issue
5
Year of publication
2000
Pages
477 - 482
Database
ISI
SICI code
1226-4865(200005)14:5<477:TSAOCM>2.0.ZU;2-V
Abstract
This study discusses a non-contact optical technique (electronic speckle pa ttern interferometry) that is well suited for thermal deformation measureme nt without any surface preparation and compensating process. Fiber reinforc ed plastics ([0](16), [0/90](8s)) were analyzed by ESPI to determine their thermal expansion coefficients. The thermal expansion coefficient of the tr ansverse direction of a uniaxial composite is evaluated as 48.78 x 10(-6)(1 /degrees C). Also, the thermal expansion coefficient of the cross-ply lamin ate [0/90](8s) is numerically estimated as 3.23 x 10(-6) (1/degrees C) that is compared with that measured by ESPI.