Resin transfer molding (RTM) process of a high performance epoxy resin. I:Kinetic studies of cure reaction

The cure kinetics of a high performance PR500 epoxy resin in the temperatur e range of 160-197 degrees C for the resin transfer molding (RTM) process h ave been investigated. The thermal analysis of the curing kinetics of PR500 resin was carried out by differential scanning calorimetry (DSC), with the ultimate heat of reaction measured in the dynamic mode and the rate of cur e reaction and the degree of cure being determined under isothermal conditi ons. A modified Kamal's kinetic model was adapted to describe the autocatal ytic and diffusion-controlled curing behavior of the resin. A reasonable ag reement between the experimental data and the kinetic model has been obtain ed over the whole processing temperature range, including the mold filling and the final curing stages of the RTM process.