Preparation of Cu-Ni film resistors with low resistivity and low TCR

Citation
M. Ishikawa et al., Preparation of Cu-Ni film resistors with low resistivity and low TCR, T I MET FIN, 78, 2000, pp. 86-88
Citations number
9
Categorie Soggetti
Metallurgy
Journal title
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING
ISSN journal
00202967 → ACNP
Volume
78
Year of publication
2000
Part
2
Pages
86 - 88
Database
ISI
SICI code
0020-2967(200003)78:<86:POCFRW>2.0.ZU;2-7
Abstract
Thin film resistors with low TCR and low electric resistivity were prepared from phosphorus free Cu-Ni alloy obtained by electroless and electrolytic deposition with heat treatment at low temperature.