Flip-chip bonded hybrid CMOS/SEED optoelectronic smart pixels

Hybrid integration of GaAs/AlGaAs multiple quantum well self electro-optic effect device (SEED) arrays are demonstrated flip-chip bonded directly onto 1 mu m silicon CMOS circuits. The GaAs/AlGaAs MQW devices are designed for 850 nm operation. Some devices are used as input light detectors and other s serve as output light modulators. The measurement results under applied b iases show good optoelectronic characteristics of elements in SEED arrays. Nearly the same reflection spectrum is obtained for the different devices a t an array and the contrast ratio is more than 1.2:1 after flip-chip bondin g and packaging. The transimpedance receiver-transmitter circuit can be ope rated at a frequency of 300 MHz.