High-density flexible interconnect for two-dimensional ultrasound arrays

We present a method for fabricating flexible multilayer circuits for interc onnection to 2-D array ultrasound transducers. In addition, we describe fou r 2-D arrays in which such flexible interconnect is implemented, including transthoracic arrays with 438 channels operating at up to 7 MHz and intraca rdiac catheter arrays with 70 channels operating at up to 7 MHz. We employ thin and thick film microfabrication techniques to batch produce the interc onnect circuits with minimum dimensions of 12-mu m lines, 40-mu m vias, and 150-mu m array pitch. The arrays show 50-Omega insertion loss of -60 to -8 4 dB and a fractional bandwidth of 21 to 67%. The arrays are used to obtain real time, in vivo volumetric scans.