Effects of air agitation on conductivity in acid copper electrodeposition solutions

The effects of air agitation on electrolyte conductivity have been consider ed. Experimental data obtained from a conductivity probe was found to be co mparable to theoretical models for conductivity which show that localized r eductions of 20-30% are quite normal in an acid copper electrolyte. Such no nuniformity within an electroplating tank could be one cause of the throwin g power/metal distribution variations which are normally attributed to surf ace irregularities or poorly designed agitation systems. These aspects have particular bearing for printed circuit board (PCB) manufacture where consi stency in electrodeposition is paramount to ensure low defect or failure ra tes, especially within high aspect ratio through-holes.