The morphology & electrochemical behavior of electrodeposited nickel onto metallized silicon

Electrodeposition of nickel from a nickel sulfamate electrolyte onto five s ubstrates (copper, metallized glass, metallized copper and metallized n-typ e and p-type silicon) was studied. Analysis by scanning electron microscopy showed the first step of growth and the morphology of a thick nickel coati ng. The nature of the substrate had a great influence on the electrocrystal lization via the density of germination. Both cathodic polarization and imp edance spectroscopy diagrams revealed the electrochemical behavior that cha racterizes the silicon/metal interface and allows classifying the metallic interfaces into three groups, depending on conductivity.