Atomic scale models of ion implantation and dopant diffusion in silicon

Citation
Sk. Theiss et al., Atomic scale models of ion implantation and dopant diffusion in silicon, THIN SOL FI, 365(2), 2000, pp. 219-230
Citations number
73
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
365
Issue
2
Year of publication
2000
Pages
219 - 230
Database
ISI
SICI code
0040-6090(20000417)365:2<219:ASMOII>2.0.ZU;2-E
Abstract
We review our recent work on an atomistic approach to the development of pr edictive process simulation tools. First-principles methods, molecular dyna mics simulations, and experimental results are used to construct a database of defect and dopant energetics in Si. This is used as input for kinetic M onte Carlo simulations. C and B trapping of the Si self-interstitial is sho wn to help explain the enormous disparity in its measured diffusivity. Exce llent agreement is found between experiments and simulations of transient e nhanced diffusion following 20-80 keV B implants into Si, and with those of 50 keV Si implants into complex B-doped structures. Our simulations predic t novel behavior of the time evolution of the electrically active B fractio n during annealing. (C) 2000 Published by Elsevier Science S.A. All rights reserved.