HIGH-PERFORMANCE HOT MELTS FOR BONDING POLAR AND NONPOLAR SUBSTRATES

Authors
HEUCHER R BUTTERBACH R
Citation
R. Heucher et R. Butterbach, HIGH-PERFORMANCE HOT MELTS FOR BONDING POLAR AND NONPOLAR SUBSTRATES, Tappi journal, 80(6), 1997, pp. 213-218
Citations number
3
Categorie Soggetti
Materials Science, Paper & Wood
Journal title
Tappi journal → ACNP
ISSN journal
07341415
Volume
80
Issue
6
Year of publication
1997
Pages
213 - 218
Database
ISI
SICI code
0734-1415(1997)80:6<213:HHMFBP>2.0.ZU;2-U
Abstract
Hot-melt adhesives have been developed to bond polar and nonpolar mate rials. This paper describes adhesives based on polyamide resins and on polypropylene resins. Applications in the cable industry are presente d to illustrate the potential utility of the newly developed hot melts . Additional laboratory data suggest that the new series of products c an bond a variety of difficult substrates and resist degradation in ac idic or basic environments.