This paper presents, for the first time, a 4-Mb ferroelectric random-access
memory, which has been designed and fabricated with 0.6-mu m ferroelectric
storage cell integrated CMOS technology, In order to achieve a stable cell
operation, novel design techniques robust to instable cell capacitors are
proposed: 1) double-pulsed plate read/write-back scheme; 2) complementary d
ata preset reference circuitry; 3) relaxation/fatigue/imprint-free referenc
e voltage generator; 4) open bitline cell array; 5) unintentional power-off
data protection scheme. Additionally, to improve cell array layout efficie
ncy; and 6) selectively driven cell plate scheme has been devised. The prot
otype chip incorporating these circuit schemes shows 75-ns access time and
21-mA active current at 3.3 V, 25 degrees C, 110-ns minimum cycle. The die
size is 116 mm(2) using 9 mu m(2), one-transistor/one capacitor-based memor
y cell, twin-well, single-poly, single-tungsten, and double-Al process tech
nology.