H. Hoenigschmid et al., A 7F(2) cell and bitline architecture featuring tilted array devices and penalty-free vertical BL twists for 4-Gb DRAM's, IEEE J SOLI, 35(5), 2000, pp. 713-718
A 7F(2) DRAM trench cell and corresponding vertically folded bitline (BL) a
rchitecture has been fabricated using a 0.175 mu m technology. This concept
features an advanced 30 degrees tilted array device layout and an area pen
alty-free inter-BL twist, The presented scheme minimizes local well noise b
y maximizing the number of twisting intervals. A significant improvement of
signal margin was measured on a 32-Mbyte test chip.