Electromigration and the electroplastic effect in aluminum SiC MMCs

Authors
Dariavach, NG Rice, JA
Citation
Ng. Dariavach et Ja. Rice, Electromigration and the electroplastic effect in aluminum SiC MMCs, JOM-J MIN, 52(5), 2000, pp. 40-42
Citations number
15
Categorie Soggetti
Metallurgy
Journal title
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
ISSN journal
10474838 → ACNP
Volume
52
Issue
5
Year of publication
2000
Pages
40 - 42
Database
ISI
SICI code
1047-4838(200005)52:5<40:EATEEI>2.0.ZU;2-D
Abstract
Aluminum SiC metal-matrix composites fabricated by standard powder-metallur gy compaction and sintering were subjected to high-density alternating-curr ent pulses during transverse rupture testing. Results indicate increased st rength due to electromigration. Decreases in flow stress were observed duri ng plastic deformation and were attributed to the electroplastic effect.