High resolution 3D microstructures made by localized electrodeposition of nickel

Citation
A. Jansson et al., High resolution 3D microstructures made by localized electrodeposition of nickel, J ELCHEM SO, 147(5), 2000, pp. 1810-1817
Citations number
24
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
147
Issue
5
Year of publication
2000
Pages
1810 - 1817
Database
ISI
SICI code
0013-4651(200005)147:5<1810:HR3MMB>2.0.ZU;2-H
Abstract
Techniques to create three-dimensional microstructures are still a matter o f research, and localized electrodeposition is a promising path to inexpens ive free-form microfabrication in metal. The principle is to put the tip of a needle very close to a conducting substrate submerged in a plating bath, apply typically 4-5 V, and move the tip as the metal deposits. In this pap er we report improved deposition control and the benefits of adding ammonia and ammonium formate to nickel plating solutions for enhanced resolution a nd surface smoothness. A mirror-smooth 600 mu m tall nickel column 3 mu m i n diameter was built at 3 mu m/s. Still higher axial deposition rates could be attained, as well as structure diameters down to 2 mu m. The broadening of previously built structures near the one being grown was studied, and t he usefulness of an auxilliary electrode was confirmed. The possibility of branching and joining structures was also investigated in order to realize the vision of building structures of arbitrary shapes. (C) 2000 The Electro chemical Society. S0013-4651(99)05-011-9. All rights reserved.