3-dimensional moulded circuit carriers - New process combines 3D-MID technology with IMD

Authors
Schutz, U
Citation
U. Schutz, 3-dimensional moulded circuit carriers - New process combines 3D-MID technology with IMD, KUNSTST-P E, 90(4), 2000, pp. A118
Citations number
2
Categorie Soggetti
Material Science & Engineering
Journal title
KUNSTSTOFFE-PLAST EUROPE
ISSN journal
09450084 → ACNP
Volume
90
Issue
4
Year of publication
2000
Database
ISI
SICI code
0945-0084(200004)90:4<A118:3MCC-N>2.0.ZU;2-I
Abstract
The first components made by the 3D-MID technology were produced by 2-compo nent injection moulding with subsequent metallization or by hot embossing o f conductive tracks into the surface of the components in series production . A third, less well-known process is gradually arousing interest, namely t he insert moulding of film structured with conductive tracks.