Z. Tokei et al., Effect of sulphur content and pre-annealing treatments on nickel grain-boundary diffusion in high-purity copper, PHIL MAG A, 80(5), 2000, pp. 1075-1083
Anger electron spectroscopy (AES) and radiotracers were used to study the e
ffects of pre-annealing treatments and grain boundary migration on nickel g
rain-boundary diffusion in pure 5N copper at 718 K in the B-kinetic regime.
The diffusion penetration profiles are complex, which can be interpreted b
y the copresence of stationary and moving grain boundaries. Attempts to emp
hasize the grain-boundary migration effect were made by the application of
different pre-annealing treatments before diffusion. It was shown by AES th
at this preparation procedure induces a modification in the bulk sulphur co
ntent which is a residual impurity in 5N copper. It is shown that a few ppm
of sulphur dissolved in the bulk has a pronounced influence on the data; t
he higher the sulphur content, the lower the triple-product and the grain-b
oundary migration velocity.