Stress-induced high-field gate leakage current in ultra-thin gate oxide

Citation
Jl. Wei et al., Stress-induced high-field gate leakage current in ultra-thin gate oxide, SOL ST ELEC, 44(6), 2000, pp. 977-980
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
SOLID-STATE ELECTRONICS
ISSN journal
00381101 → ACNP
Volume
44
Issue
6
Year of publication
2000
Pages
977 - 980
Database
ISI
SICI code
0038-1101(200006)44:6<977:SHGLCI>2.0.ZU;2-Q
Abstract
A number of groups have reported that the low-field stress-induced leakage current (SILC) in thin oxides increased after the oxides had been subjected to high voltage stresses. In this study, we observed that high-field SILC increased after the oxides had been subjected to high voltage stresses. The experimental results suggest strongly that SILC must be considered at a hi gh-field region, and the dependence of the high-field SILC on the measureme nt field E-ox is proportional to exp(cE(ox)), as compared to the exp(-c/E-o x), at a low field which was reported by some researchers. The high-field S ILC increases and saturates after a long stress time, when the stress time increases, which is similar to the low-field SILC. Using the method of prop ortional difference operator, the trap generation/capture time constant can be obtained. (C) 2000 Elsevier Science Ltd. All rights reserved.