The parametric yield of VLSI strongly depends on the statistical process fl
uctuations. Thus, the statistical simulation is needed for robust process,
device and circuit designs.
This article describes the statistical simulation of MOSFETs using Technolo
gy CAD (TCAD). Threshold voltage V-th and sheet resistance R-sh Obtained th
rough the statistical simulation were compared with measurements. The mean
values of the simulated V-th and R-sh agreed well with those of the experim
ents within 2% error. The standard deviations sigma revealed sufficient agr
eements within 30% error, except for n-ch V-th.
For a conventional method, larger coverage factors based on the principal c
omponent analysis are selected to generate worst-case corner models. We pro
pose a new factor selection method which uses the sensitivity analysis of a
small but critical circuit, a ring-oscillator, for obtaining BSIM3v3 worst
-case models. In this example, the proposed method selected the factor rela
ted to a gate oxidation temperature, whereas the conventional method select
ed the factor related to a LDD side-wall thickness. The proposed method was
applied to the estimations of worst-case performance of the inverter DC ch
aracteristics and data-out of DRAM. (C) 2000 Elsevier Science Ltd. All righ
ts reserved.