Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform

Citation
T. Ohyama et al., Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform, ELECTR LETT, 35(22), 1999, pp. 1971-1973
Citations number
4
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
ELECTRONICS LETTERS
ISSN journal
00135194 → ACNP
Volume
35
Issue
22
Year of publication
1999
Pages
1971 - 1973
Database
ISI
SICI code
0013-5194(19991028)35:22<1971:HIDPCD>2.0.ZU;2-J
Abstract
A hybrid integrated differential photoreceiver has been successfully fabric ated which comprises a dual photodiode (dual-PD) and a high-speed GaAs ampl ifier integrated circuit (IC) on a planar lightwave circuit (PLC) platform with integrated metal-insulation-metal (MIM) structural capacitors by using a novel flip-chip bonding technique. The bandwidth of the photoreceiver is wide enough to receive a 12Gbit/s Manchester-encoded optical signal.