T. Ohyama et al., Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform, ELECTR LETT, 35(22), 1999, pp. 1971-1973
A hybrid integrated differential photoreceiver has been successfully fabric
ated which comprises a dual photodiode (dual-PD) and a high-speed GaAs ampl
ifier integrated circuit (IC) on a planar lightwave circuit (PLC) platform
with integrated metal-insulation-metal (MIM) structural capacitors by using
a novel flip-chip bonding technique. The bandwidth of the photoreceiver is
wide enough to receive a 12Gbit/s Manchester-encoded optical signal.