Solid logic technology: Versatile, high-performance microelectronics (Reprinted from IBM Journal of Research and Development, vol 8, 1964)

A new microelectronics packaging technique, called Solid Logic Technology ( SLT), utilizes silicon planar glass-encapsulated transistors and diodes, an d graphic arts techniques for producing high-quality, passive components ha ving tight tolerances. The result is a process permitting the low-cost real ization of a variety of versatile, high-performance circuit modules. The salient features of SLT are described: the unique form of the semicondu ctor devices, the module fabrication process, and some performance results. In addition, insight is provided to the range of components that may be fa bricated with this technology, i.e., inductors, capacitors and high-power t ransistors. Examples are shown of specific high-speed, high-density and com plex circuit packages.