Effect of grain-boundary stabilization on the strength, thermal conductivity, and dielectric properties of aluminum nitride

Authors
Ivanov, SN Zhukova, LM Soifer, YM Khazanov, EN Taranov, AV
Citation
Sn. Ivanov et al., Effect of grain-boundary stabilization on the strength, thermal conductivity, and dielectric properties of aluminum nitride, INORG MATER, 36(5), 2000, pp. 504-507
Citations number
10
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
INORGANIC MATERIALS
ISSN journal
00201685 → ACNP
Volume
36
Issue
5
Year of publication
2000
Pages
504 - 507
Database
ISI
SICI code
0020-1685(200005)36:5<504:EOGSOT>2.0.ZU;2-F
Abstract
The thermal conductivity, dielectric properties, and strength of AlN cerami cs were studied. The ceramics were prepared by semidry pressing and sinteri ng. Increasing the sintering time was found to increase the thermal conduct ivity of the ceramics up to 200 W/(m K). A nonequilibrium-phonon-propagatio n method was used to analyze the effect of grain boundaries and processing conditions on the thermal conductivity of the ceramics.