THERMAL AND ELECTRICAL CONDUCTANCE ACROSS COPPER JOINTS BELOW 100MK

Authors
CORBETT KA SAWADA A SMITH EN
Citation
Ka. Corbett et al., THERMAL AND ELECTRICAL CONDUCTANCE ACROSS COPPER JOINTS BELOW 100MK, Physica. B, Condensed matter, 194, 1994, pp. 1211-1212
Citations number
7
Categorie Soggetti
Physics, Condensed Matter
Journal title
Physica. B, Condensed matter → ACNP
ISSN journal
09214526
Volume
194
Year of publication
1994
Part
1
Pages
1211 - 1212
Database
ISI
SICI code
0921-4526(1994)194:<1211:TAECAC>2.0.ZU;2-U
Abstract
We have measured the thermal conductance of copper and gold plated cop per contact joints from 20mK to 100mK. We have measured the electrical conductance of the joints. For small area contacts the linear relatio nship of thermal conductivity with temperatures was not followed, poss ibly due to strain near the contacts. We compared planar contact joint s with tapered hole-cone joints of the type used in the Cornell microk elvin cryostat.