Experimental and theoretical results are presented concerning the applicati
on of a wide gap amorphous silicon layer to improve the injection efficienc
y into GaAs regions. A 30 nm a-Si:H film is grown by low temperature (T = 2
70 degrees C) plasma enhanced chemical vapour deposition and has an energy
gap of 1.8 eV, which is 0.4 eV larger than that of the underlying crystalli
ne GaAs. The pin diode which is fabricated has device quality rectifying pr
operties and a reverse breakdown voltage of 120 V. When operated as a curre
nt switch it has a reverse recovery time of 20-30 ns, largely determined by
the minority carrier recombination in the GaAs intrinsic layer. The theore
tical analysis of the device, based on a numerical physical simulator, show
s that the density of states at the interface affects the forward bias volt
ages and currents. (C) 2000 Elsevier Science B.V. All rights reserved.