Imagers using amorphous silicon thin film on application specific integrated circuit technology

As imaging systems become more demanding, the performance of image sensors has to keep pace with the development of computer components to process and store images. Besides resolution, color reproduction, dynamic range and sp eed, future image sensors are expected not only to provide raw signals, but to include part of the image processing system on-chip. Unlike charge coup led devices (CCDs) and complementary metal oxide semiconductor (CMOS) image rs, a sensor in thin film application specific integrated circuit (TFA) tec hnology is a vertically integrated device. The thin film detector is fabric ated independently of the application specific integrated circuit (ASIC) an d is therefore not affected by ASIC scaling. Fill factors are commonly clos e to 100%. The technology offers high flexibility since an existing ASIC ca n be supplied with different detector structures for application specific d evice optimization. (C) 2000 Elsevier Science B.V. All rights reserved.