Rb. Wehrspohn et al., Effect of amorphous silicon material properties on the stability of thin film transistors: evidence for a local defect creation model, J NON-CRYST, 266, 2000, pp. 459-463
We present an improved description of the defect creation kinetics in amorp
hous silicon thin film transistors and analyze in detail the dependence on
the key amorphous silicon material properties: Urbach energy, hydrogen cont
ent, hydrogen bonding and intrinsic stress. The results support a model for
defect creation, involving Si-Si bond breaking, with only local hydrogen b
onding rearrangements to stabilize the broken bond, as opposed to models in
volving long range hydrogen diffusion. On the other hand, defect annealing
proceeds by breaking Si-H bonds and long-range diffusion of hydrogen. (C) 2
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