Effect of amorphous silicon material properties on the stability of thin film transistors: evidence for a local defect creation model

Citation
Rb. Wehrspohn et al., Effect of amorphous silicon material properties on the stability of thin film transistors: evidence for a local defect creation model, J NON-CRYST, 266, 2000, pp. 459-463
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF NON-CRYSTALLINE SOLIDS
ISSN journal
00223093 → ACNP
Volume
266
Year of publication
2000
Part
A
Pages
459 - 463
Database
ISI
SICI code
0022-3093(200005)266:<459:EOASMP>2.0.ZU;2-Y
Abstract
We present an improved description of the defect creation kinetics in amorp hous silicon thin film transistors and analyze in detail the dependence on the key amorphous silicon material properties: Urbach energy, hydrogen cont ent, hydrogen bonding and intrinsic stress. The results support a model for defect creation, involving Si-Si bond breaking, with only local hydrogen b onding rearrangements to stabilize the broken bond, as opposed to models in volving long range hydrogen diffusion. On the other hand, defect annealing proceeds by breaking Si-H bonds and long-range diffusion of hydrogen. (C) 2 000 Elsevier Science B.V. All rights reserved.