In this work we present a study of the relation between the concentration o
f dopant gas used in the deposition of amorphous silicon films and the acti
ve dopant concentration in the material. Fitting of experimental dark and l
ight conductivity data have been performed by a numerical model to evaluate
the ratio between dangling bond density and phosphine concentration. Simul
ation results show that this ratio is constant for dopant concentration up
to 5 x 10(18) and increases to 1 for larger dopant concentration. (C) 2000
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