A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching

Authors
Li, ZH Yang, ZC Xiao, ZX Hao, YL Li, T Wu, GY Wang, YY
Citation
Zh. Li et al., A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching, SENS ACTU-A, 83(1-3), 2000, pp. 24-29
Citations number
9
Categorie Soggetti
Instrumentation & Measurement
Journal title
SENSORS AND ACTUATORS A-PHYSICAL
ISSN journal
09244247 → ACNP
Volume
83
Issue
1-3
Year of publication
2000
Pages
24 - 29
Database
ISI
SICI code
0924-4247(20000522)83:1-3<24:ABMVLG>2.0.ZU;2-L
Abstract
A bulk micromachined vibratory lateral gyroscope, which is fabricated with Silicon-glass wafer bonding and deep trench etching, has been developed. By using entirely symmetric springs, drive mode and sense mode frequencies of the gyroscope are matched precisely, which is important to improve sensiti vity. The gyroscope has a large mass and capacitance, and its thermal-mecha nical noise floor is estimated to be about 0.05 degrees/h/Hz(1/2). (C) 2000 Elsevier Science S.A. All rights reserved.