Integration of through-wafer interconnects with a two-dimensional cantilever array

High-density through-wafer interconnects are incorporated in a two-dimensio nal (2D) micromachined cantilever array. The design addresses alignment and density issues associated with 2D arrays. Each cantilever has piezoresisti ve deflection sensors and high-aspect ratio silicon tips. The fabrication p rocess and array operation are described. The integration of cantilevers, t ips, and interconnects enables operation of a high-density 2D scanning prob e array over large areas. (C) 2000 Elsevier Science S.A. All rights reserve d.