Microcoils and microrelays - an optimized multilayer fabrication process

In this paper a complete process technology for the integrated fabrication of inductive micro electromechanical systems (MEMS) is presented. The intro duced technology comprises the technologies of SD-UV-Depth Lithography, ele ctroplating of various metals and alloys, insulation and planarization of m agnetic or electrical microstructures using benzocyclobutene (BCB) and anis otropic trench etching of passivation layers to incorporate metallic struct ures into multilayer systems. By utilizing this technology inductive micro components and systems for use in sensing, actuation and microelectronics c an easily be fabricated. To demonstrate the applicability of the introduced technology to complex micro systems microcoils with and without magnetic c ores and a microrelay for high current switching have been built by means o f this process. (C) 2000 Elsevier Science S.A. All rights reserved.