In the paper we have discussed the possibilities of dry RF (13.56 MHz) plas
ma etching of nanocrystalline cubic boron nitride (BN) films. 110 nm thick
BN layers were deposited on Si substrates by means of the reactive pulse pl
asma CVD method and then locally covered with Al metallization playing the
role of a mask. Subsequently, samples were exposed to the influence of Ar,
CH4 and Ar + CH4 RF plasma environments. In general, the material was more
efficiently removed at higher negative self-bias potentials between electro
des. The best results were obtained when BN layers were etched in plasma in
duced in an Ar + CH4 mixture, i.e. in the course of a physico-chemical proc
ess. (C) 2000 Elsevier Science S.A. All rights reserved.