Cubic boron nitride (c-BN) films can be used as hard coatings and for elect
ronic devices due to their outstanding material properties, but the gas pha
se deposition of c-BN is still a challenging task. Until now it has only be
en possible to achieve nanocrystalline c-BN layers via physical vapor depos
ition (PVD) methods with rather weak film qualities. Only a chemical vapor
deposition (CVD) process for c-BN can produce high quality films with mater
ial properties similar to those of the product achieved by high pressure. h
igh temperature professes (HPHT) conventional routes. Therefore it is essen
tial to tune the individual steps in the CVD process (nucleation, growth an
d selective etching) in a similar manner to that for diamond CVD to enable
continuous growth of c-BN.
Since selective etching of hexagonal boron nitride (h-BN) and sp(2) phases
is still a major problem, we investigated the interaction of h-BN and c-BN
with different reactive gases - ammonia (NH3), chlorine (Cl-2), hydrogen ch
loride (HCl) and boron trifluoride (BF3) - regarding their etching behaviou
r and surface stabilisation properties. Etching ratios from approximate to
10:1 up to 450:1 were found in the temperature range 600-1300 degrees C for
the h-BN/c-BN system, clearly indicating a high selectivity due to kinetic
effects.
The reaction mechanisms will be discussed with respect to the kinetic diffe
rentiation of the degradation of c-BN and h-BN (selective etching). The mor
phological changes and the quality of the remaining BN phases was studied b
y scanning electron microscopy (SEM), X-ray diffraction (XRD), and infrared
and Raman spectroscopy and these indicated a homogeneous decay of the indi
vidual phases. Since a homogeneous decay of c-BN resembles the reversed gro
wth, the study of the interaction of both BN phases with reactive gases all
owed us to collect more detailed information of the molecular mechanisms in
volved in the formation of the individual phases. These results will provid
e new routes for growing c-BN in a CVD process. (C) 2000 Elsevier Science S
.A. All rights reserved.