Degradation of epoxy resin by partial discharges

Citation
Dm. Hepburn et al., Degradation of epoxy resin by partial discharges, IEE P-SCI M, 147(3), 2000, pp. 97-104
Citations number
26
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEE PROCEEDINGS-SCIENCE MEASUREMENT AND TECHNOLOGY
ISSN journal
13502344 → ACNP
Volume
147
Issue
3
Year of publication
2000
Pages
97 - 104
Database
ISI
SICI code
1350-2344(200005)147:3<97:DOERBP>2.0.ZU;2-0
Abstract
Epoxy resins are used in the production of high-voltage insulation componen ts. Partial discharges, inherent in high-voltage installations, degenerate the resinous material and cause degradation of the insulation thus reducing the working life of the component. An understanding of the nature of the c hemical changes taking place under partial discharge stressing should allow the production of improved insulation systems and/or identification of dia gnostic methods for monitoring the state of existing equipment. Attenuated total reflectance Fourier transform infrared (ATR-FTIR) microspectroscopy i s used to determine the chemical changes to the surface of a bisphenol-A ba sed epoxy resin resulting from partial discharge stressing in an air enviro nment. Differences in stressed resin surface chemistry are found to be depe ndent upon the humidity of the stressed air. The variation in degradation p roducts occurring in dry and in moist air are discussed and possible reacti ons to explain these differences are presented.