Epoxy resins are used in the production of high-voltage insulation componen
ts. Partial discharges, inherent in high-voltage installations, degenerate
the resinous material and cause degradation of the insulation thus reducing
the working life of the component. An understanding of the nature of the c
hemical changes taking place under partial discharge stressing should allow
the production of improved insulation systems and/or identification of dia
gnostic methods for monitoring the state of existing equipment. Attenuated
total reflectance Fourier transform infrared (ATR-FTIR) microspectroscopy i
s used to determine the chemical changes to the surface of a bisphenol-A ba
sed epoxy resin resulting from partial discharge stressing in an air enviro
nment. Differences in stressed resin surface chemistry are found to be depe
ndent upon the humidity of the stressed air. The variation in degradation p
roducts occurring in dry and in moist air are discussed and possible reacti
ons to explain these differences are presented.