Si1-x-yGexCy-channel p-MOSFET's with improved thermal stability

Citation
Ac. Mocuta et Dw. Greve, Si1-x-yGexCy-channel p-MOSFET's with improved thermal stability, IEEE ELEC D, 21(6), 2000, pp. 292-294
Citations number
13
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE ELECTRON DEVICE LETTERS
ISSN journal
07413106 → ACNP
Volume
21
Issue
6
Year of publication
2000
Pages
292 - 294
Database
ISI
SICI code
0741-3106(200006)21:6<292:SPWITS>2.0.ZU;2-P
Abstract
We report the fabrication of heterostructure Si1-x-yGexCy channel p-MOSFET' s with low-carbon Si1-x-yGexCy channels. The use of low carbon mole fractio n (y = 0.002) has only a small effect (<<kT) on the valence band offset. A carbon mole fraction of this value dues improve the thermal stability of th e channel region and make it possible to use conventional thermal oxidation and ion implant annealing without causing layer relaxation, A peak room-te mperature hole mobility of 200 cm(2)/Vs was measured in a device with a 30- nm channel and a germanium mole fraction ramped from 10% to 40%.