Jj. Ho et al., Development of a microelectromechanical system pressure sensor for rehabilitation engineering applications, INT J ELECT, 87(6), 2000, pp. 757-767
Based on computer finite-element analysis ANSYS 5.3 and microelectromechani
cal systems (MEMS) technologies, a micropressure sensor was designed and fa
bricated. The sensor can be used to measure the distribution of normal stre
ss between soft tissues on an above-knee amputee's skin and the contacting
surface of a rehabilitation device. A square membrane with dimensions 2400
mu m x 2400 mu m x 80 mu m is formed by backside photolithography and wet e
tching of an n-type [100] monolithic silicon wafer. On the middle of the me
mbrane edge, an X-shaped silicon wafer was implanted with boron ions and th
en enhanced by diffusion to form a piezoresistive strain gauge. In the desi
gn process, a finite-element method is used to analyse the effects of press
ure sensitivity and its temperature coefficients. The developed micropressu
re sensors, which have smaller weight and volume than a conventional machin
e type, perform well and fit our design specifications.