Rigid stamp indentation for a thermoelastic half-plane

Authors
Citation
Ck. Chao et B. Gao, Rigid stamp indentation for a thermoelastic half-plane, INT J SOL S, 37(34), 2000, pp. 4635-4654
Citations number
20
Categorie Soggetti
Mechanical Engineering
Journal title
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES
ISSN journal
00207683 → ACNP
Volume
37
Issue
34
Year of publication
2000
Pages
4635 - 4654
Database
ISI
SICI code
0020-7683(200008)37:34<4635:RSIFAT>2.0.ZU;2-H
Abstract
A problem for the thermoelastic half-plane indented by a rigid punch of var ious shapes is solved explicitly in this paper by the method of analytical continuation. The effects of applied loadings, the profile of the punch and material properties on the contact stress under the punch face are studied in detail and shown in graphic form. A rigid punch of three different prof iles with or without friction is considered under the complete or incomplet e indentation condition. (C) 2000 Elsevier Science Ltd. All rights reserved .