Rs. Kern et Rf. Davis, SILICON-CARBIDE FOR HIGH-TEMPERATURE MICROELECTRONICS - RECENT ADVANCES IN MATERIAL GROWTH VIA GAS-SOURCE MBE AND DEVICE RESEARCH, Materials science & engineering. B, Solid-state materials for advanced technology, 46(1-3), 1997, pp. 240-247
Thin films of silicon carbide (SIG) have been grown at 1000-1500 degre
es C on vicinal and on-axis alpha(6H)-SiC(0001) substrates by gas-sour
ce molecular beam epitaxy (GSMBE). Growth using only SiH4 and C2H4 res
ulted in 3C-SiC(111) epilayers under all deposition conditions and sub
strate orientations. With the addition of H-2, films of 6H-SiC(0001) w
ere deposited on the vicinal substrates at deposition temperatures gre
ater than or equal to 1350 degrees C. Kinetic analysis showed all depo
sitions to be surface reaction controlled. In situ doping was achieved
by intentional introduction of nitrogen and aluminum into the growing
crystals. SiC-based microelectronic devices operable at elevated temp
eratures, including several types of power metal oxide semiconductor f
ield effect transistors (MOSFETs). bipolar transistors, and thyristors
have been fabricated. The properties of selected devices and the circ
uits made from them are described. (C) 1997 Elsevier Science S.A.