T. Takashima et al., Effect of sulfuric acid solution on fracture strength of silicon nitride ceramics/nickel joints, J CERAM S J, 108(5), 2000, pp. 510-514
The nickel metal joined to silicon nitride ceramics using silver-copper-tit
anium brazing and titanium filler was placed in a sulfuric acid solution at
323 K for up to 214h. Joining strengths were measured by the 4-point bendi
ng test. Microstructures of the reaction layer and porous layer were invest
igated with a scanning electron microscopy and an electron probe microanaly
zer, Fracture strength of the normal joint was 245 MPa before soaking and d
ecreased to 170 MPa after 16h and to 100 MPa after 144h in 1N H2SO4. Three
regions were observed on the fracture surface: the region I at the reaction
layer/brazing layer interface, the region II at the bonding interface neig
hborhood in porous layers (in silicon nitride) and the region III at the si
licon nitride/reaction layer interface, In the porous layer of the silicon
nitride was formed yttrium-oxide and aluminium-oxide elute by the soaking t
he sintering aid in the grain boundary of silicon nitride. The growth of th
e porous layers occurred on the joint surface of silicon nitride ceramics w
ith different roughness due to the ground surface roughness of the test pie
ce. The wedge-shaped porous layers were formed a residual stress on the int
erfacial side of the silicon nitride ceramics joints.