Rotated nonconcentric matching of advanced lithography tools to an installe
d base of older tools is emerging as a viable technique for production wafe
r fabs. The technique involves use of common matching reticles and golden s
tandard wafers. When properly applied, this technique enables improved repe
atability of a process from tool-to-tool and from day-to-day. As lithograph
y technology evolves, the matching process facilitates the integration of t
ools with different capabilities into the fabrication process, optimizing p
rocess flow and in turn, increasing process yield, without the high capital
outlay required to outfit an entire fab with the most advanced tool.