ALN EPITAXIAL-GROWTH ON ATOMICALLY FLAT INITIALLY NITRIDED ALPHA-AL2O3 WAFER

Citation
T. Suetsugu et al., ALN EPITAXIAL-GROWTH ON ATOMICALLY FLAT INITIALLY NITRIDED ALPHA-AL2O3 WAFER, Applied surface science, 117, 1997, pp. 540-545
Citations number
9
Categorie Soggetti
Physics, Condensed Matter","Chemistry Physical","Materials Science, Coatings & Films
Journal title
ISSN journal
01694332
Volume
117
Year of publication
1997
Pages
540 - 545
Database
ISI
SICI code
0169-4332(1997)117:<540:AEOAFI>2.0.ZU;2-M
Abstract
The (1 (1) over bar 02) alpha-Al2O3 surface and the initial nitriding AlN layer are investigated using the atomic-force microscope. The init ial nitriding method is to convert the (1 (1) over bar 02) alpha-Al2O3 surface to a nanometer-thick AlN single-crystal buffer layer. The epi taxial AlN film is deposited by metalorganic chemical vapor deposition with and without the initial nitriding. Atomic step structure is foun d to be formed after the H-2 annealing. The atomic step structure is m aintained during the initial nitriding time up to 5 min. Smooth AIN ep itaxial films have been successfully deposited on the 2 inch diameter (1 (1) over bar 02) alpha-Al2O3 wafer without any inverse-twin through out the wafer by keeping the atomic step structure of the initial nitr iding buffer layer.